Company QUALCOMM SEMICONDUCTORES Y SISTEMAS AVANZADOS DE BAJA CALIFORNIA Job Area Engineering Group, Engineering Group Failure Analysis Engineering General Summary The responsibility of this position is to perform Failure Analysis of Semiconductor IC devices. Evaluate the electrical characteristics of systems and/or integrated circuits to determine cause of failure by using Electrical fault isolation tools/techniques. Review of test datalogs from multiple sources will be necessary as part of the investigation. High level of collaboration and interaction with Product Engineering, Design Engineering, Quality Engineering, and Foundry Engineering teams is necessary. Summarize completed analysis work to drive corrective action. The qualified candidate will work individually and in cross-discipline team to analyze design, reliability, yield or field failures down to a physical root cause. The analysis will involve use of various state-of-the-art analytical tools, processing the acquired data and information sets to arrive at a conclusion regarding the cause of failure. Ability to seamlessly support and work with cross-functional multi-national engineering teams. Minimum Qualifications Bachelor's degree or equivalent in Science, Engineering, or related field and 2+ years of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience. Master's degree in Science, Engineering, or related field and 1+ year of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience. PhD in Science, Engineering, or related field. 1+ year of working experience in a physical/chemical laboratory setting. Primary Responsibilities Performs failure analyses on complicated issues requiring creative problem solving. Acts as the case owner for multiple issues and devices in parallel. Applies advanced knowledge in an area of failure analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing, etc.) to solve problems, and seeks resources from other teams to find alternatives. Administers non‑destructive testing on devices using imaging tools (e.g., X‑ray, C‑SAM) and/or optical inspections. Hands‑on electrical fault isolation analysis by use of static laser techniques XIVA, OBIRCh and Photo Emission Microscopy, Lock‑In Thermal microscopy to localize areas of interest and isolate location of defect. Hands‑on advanced electrical fault isolation techniques, Dynamic Laser stimulation, thermal and photonic fault injection while interfacing with system level, automated test equipment and bench testing platforms for functional debug. Performs physical failure analysis on module, package and individual IC to identify evidence of defects on high‑risk, isolated issues in which analysis can only be performed once on a single device. Documents results of failure analysis, reports identified root cause and delivers conclusions to requesters. Skills Requirements Fast to learn and able to perform independent work. Strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis and wafer fabrication process. Proficient in various physical and electrical analysis techniques such as mechanical polishing, chemical delayering, SEM inspection, curve trace, thermal emission, photon emission, OBIRCH/TIVA. Proficient in tester interface optical fault isolation including Soft Defect Localization, Laser Voltage Probing. Frequency mapping, time‑resolved emission and thermal mapping. Experience in SEM based nano‑probing with EBIC, EBAC and EBIRCH on planar, SOI and Finfet technologies. Familiar with SCAN logic, Memory BIST and RF/Analog design strategies. Familiar with reliability testing for device and packaging product qualification including CDM, HBM, TLP, HTOL, BHAST, BURN‑IN, etc. FA experience in semiconductor industry preferred. Must be a good communicator, have good organization and project management skills, be able to work in a laboratory environment, and be effective in getting results by working with multi‑functional teams. Flexible working time and able to work on weekend shift or midnight shift. Experience in programming languages such as Python, scripting, Power BI, etc. Preferred Qualifications Masters in Electrical Engineering, Microelectronics, Physics related. Work Experiences 2+ years chip‑level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience. Skills Automated Test Equipment (ATE) Data Analysis Failure Analysis Product Development Product Reliability Applicants Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e‑mail disability‑ or call Qualcomm's toll‑free number. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. #J-18808-Ljbffr