Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Micron Technology’s vision is to transform how the world uses information to enrich life for all. Through innovation, collaboration, and customer focus, Micron is a global leader in memory and storage solutions, delivering cutting‑edge technologies across DRAM, LPDRAM, Graphics DRAM, NAND, HBM, SSDs, and more. The Signal Integrity Research and Development (SI R&D) team supports Micron’s current and future product development by delivering end‑to‑end system analysis, including IC packages, PCBs, and measurements to ensure optimal Signal Integrity (SI) and Power Integrity (PI) performance. As a NCG Signal Integrity (SI) Engineer at Micron Technology Inc., you will be responsible for working with the Signal Integrity Research and Development (SI R&D) team as it supports all of Micron’s current and future product developments. Major product technologies developed at Micron include but not limited to DRAM, LPDRAM, NAND, Graphics, HBM and Solid‑State Drives (SSDs) within the server, consumer, wireless, and embedded product groups. A major SI R&D team focus is integrated circuit packaging. The team owns all steps of the signal and power integrity support process including die and package model generation, product performance analysis, system‑level SI evaluation, measurement, correlation, and customer support. The team also supports future specification development within several industry standards groups including JEDEC, ONFI, and IBIS. The group working environment is diverse, challenging, and team oriented. This position requires a self‑motivated candidate who enjoys leading and taking ownership of assigned projects, can exhibit good written and verbal communication skills, and can work well in a diverse team environment. Responsibilities Lead the design and analysis of high‑speed memory interfaces and power distribution networks (PDN). Drive SI/PI development across a broad range of Micron products to ensure electrical performance through modeling, simulation, analysis, and measurement correlation. Own and execute end‑to‑end SI/PI analysis processes, including die, package, and system‑level modeling and evaluation. Represent the SI R&D organization in cross‑functional technical forums, collaborating with package design, silicon design, system design, product engineering, and marketing teams. Drive and contribute to SI/PI aspects of future industry standards such as JEDEC, ONFI, and IBIS. Develop and refine SI/PI methodologies, analysis flows, and best practices to support current and future technologies. Lead path‑finding and innovation activities for I/O and channel architectures enabling higher speeds and densities. Provide technical leadership, coaching, and mentorship to junior engineers while supporting external customers as needed. The specified role does not encompass the following responsibilities: Finalization of sales agreements or the execution of sales contracts is prohibited. The role also does not carry the authority to make definitive decisions regarding contracts, be it their conclusion or termination. Furthermore, the role is not designed to involve participation in pricing negotiations or the authorization of contracts. These activities fall beyond the permissible duties of the position. Minimum Qualifications MSEE or PhD degree, or bachelor’s with 2 years of experience. Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience. Required experience and working knowledge of E.M. field solvers (quasi‑static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc. Sound understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single‑ended interface technologies. Knowledgeable about Printed Circuit Board (PCB) layout or electrical package design techniques. Working knowledge of design and analysis of high‑speed single‑ended or differential buses. Familiarity and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc. Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths. Preferred Qualifications Experience with statistical and peak distortion analysis tools (e.g., JMP or equivalent). Prior experience in the memory industry. Demonstrated leadership skills with strong written and verbal communication abilities. Exposure to or understanding of AI/ML concepts. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. #J-18808-Ljbffr