MISSION We are looking for a highly skilled Assembly Process Engineer specialized in Package-on-Package (PoP) and Underfill technologies to drive advanced SMT manufacturing processes at our Hermosillo site. In this role, you will lead the development, optimization, and scaling of complex assembly solutions for high-density electronic products, ensuring precision, reliability, and process excellence. RESPONSIBILITIES: PoP (Package-on-Package) Process Development Develop and maintain flux/paste dipping processes, optimizing transfer height and consistency. Fine-tune high-precision placement parameters (X, Y, θ) to ensure accurate top-package alignment. Analyze and mitigate component warpage during reflow to prevent HiP or open joint defects. Underfill & Encapsulation Optimize dispensing parameters (needle selection, pressure, speed) for CUF or jetting processes. Improve flow dynamics, ensuring full coverage with zero voids or overflow. Evaluate and select underfill materials , considering Tg, CTE, and mechanical properties for long-term reliability. Execute Design of Experiments (DOE) to validate materials and process parameters Lead root cause analysis using tools such as cross-sectioning, CSAM, and X-ray Develop and maintain SOPs, PFMEAs, and Control Plans for PoP and Underfill processes. What Your Profile Should Look Like: We\'re looking for a hands-on-engineer with strong technical depth and a passion for advanced manufacturing technologies. Bachelor\'s degree in Mechanical, Mechatronics, Materials Science, Chemical Engineering , or related. 3+ years of experience in SMT assembly, specifically with PoP and automated dispensing systems. Experience with equipment such as Nordson ASYMTEK, Camalot, or similar. Technical Expertise: Strong knowledge of thermal profiling (KIC/ECD) Solid understanding of solder paste chemistry and underfill rheology . Experience with AOI and 3D X-ray inspection systems. Familiarity with high-density / fine pitch assemblies. Languages: Professional fluency in English . Nice to Have: Experience with fine pitch (≤0.4mm) assemblies. Knowledge of J-STD and IPC-A-610 standards . Six Sigma Green or Black Belt certification. What set us apart? We design and manufacture our solutions in our own facilities across Europe, the Americas, and Asia, ensuring quality and innovation at every stage. In addition to our own products, we also offer contract manufacturing services, helping other companies bring their technology to life. Join a company that offers competitive benefits, flexibility, and a people-centered culture. Your next career move starts here. #GoingBeyond with KEENFINITY #J-18808-Ljbffr